Surface activation for low temperature wafer fusion bonding by radicals produced in an oxygen discharge-Reference-Cited by-同舟云学术

Surface activation for low temperature wafer fusion bonding by radicals produced in an oxygen discharge

Published:2009-10 Issue:1 Volume:155 Page:145-151
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Kowal J.,Nixon T.,Aitken N.,Braithwaite N.St.J.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

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4. Micromechanical inclinometer;Mescheder;Sens. Actuators A,1997

5. Oxidation and induced damage in oxygen plasma in situ wafer bonding;Pasquariello;J. Electrochem. Soc.,2000

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