Anisotropic conductive adhesion of microsensors applied in the instance of a low pressure sensor-Reference-Cited by-同舟云学术

Anisotropic conductive adhesion of microsensors applied in the instance of a low pressure sensor

Published:2002-04 Issue: Volume:97-98 Page:323-328
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Briegel R.,Ashauer M.,Ashauer H.,Sandmaier H.,Lang W.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. K. Orthmann, J. Schmidt, Kleben in der Elektronik, Expert Verlag, 1995, pp. 99–120. ISBN 3816911668.

2. B.J.K. Kaupp, ACA in Microsystem-Technology, HSG-IMIT, Villingen-Schwenningen, 1997.

3. M. Holloway, L. Crane, S. Peters, Flipchip-Verbindungen mit hochentwickelten Klebstoffen, Productrionic 10/99.

4. J. Liu, Recent advances in conductive adhesives for direct chip attach applications, Microsystem Technologies, Vol. 5, Springer, Berlin, 1998, pp. 72–80.

5. T. Gesang, Anisotrope leitfähige Klebeverbindung für nicht flexible Fügeparameter mit Fine-Pitch-Kontakten, IFAM, Bremen, 1998.

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