A Review of Hydrophilic Silicon Wafer Bonding
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference125 articles.
1. A study of glass surfaces in optical contact
2. Tabor D. Winterton R. H. S. , 312(1511), 435 plate (1969).
3. Field Assisted Glass‐Metal Sealing
4. Glass−sealed GaAs−AlGaAs transmission photocathode
5. Wafer bonding for silicon‐on‐insulator technologies
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