Resist materials for proton micromachining
Author:
Publisher
Elsevier BV
Subject
Instrumentation,Nuclear and High Energy Physics
Reference15 articles.
1. Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process)
2. Deep X-ray lithography for the production of three-dimensional microstructures from metals, polymers and ceramics
3. K. Ikuta, K. Hirowatari, Proceedings of IEEE International Workshop on Micro Electro Mechanical Systems, vol. 47, 1993, p. 42
4. A. Bertsch, H. Lorenz, P. Renaud, Proceedings of MEMS IEEE, Heidelberg, Germany 1998, p. 18
5. A. Bertsch, S. Zissi, J.Y. Jezequel, S. Corbel, J.C. Andre, Microsystem Technologies, vol. 47, Springer, Berlin, 1997, p. 42
Cited by 57 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Design considerations for a compact proton beam writing system aiming for fast sub-10 nm direct write lithography;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;2017-08
2. In situ ion-beam-induced luminescence analysis for evaluating a micrometer-scale radio-photoluminescence glass dosimeter;Japanese Journal of Applied Physics;2016-05-31
3. Fabrication and evaluation of flexible Mach–Zehnder waveguide structure embedded in a poly(dimethylsiloxane) thin film using a proton microbeam;Japanese Journal of Applied Physics;2016-05-20
4. Ion Micro Beam, promising methods for interdisciplinary research;Journal of Instrumentation;2016-05-03
5. Fabrication and analysis of polymer microstructures through ion microprobe techniques;Journal of Applied Polymer Science;2015-12-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3