Growth kinetics and mechanism of Pd2Zn9 at the interface of Pd substrate with molten Sn–9wt.%Zn solder
Author:
Funder
Ministry of Science and Technology
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference19 articles.
1. Interfacial reactions between lead-free solders and common base materials
2. Sn–0.7wt.%Cu/Ni interfacial reactions at 250°C
3. Roles of Cu in Pb-free solders jointed with electroless Ni(P) plating
4. Interfacial reactions and mechanical properties between Sn–4.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu–0.05Ni–0.01Ge lead-free solders with the Au/Ni/Cu substrate
5. Suppressing Ni3Sn4 formation in the Sn–Ag–Cu solder joints with Ni–P/Pd/Au surface finish
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Microstructure, electrochemical and mechanical properties of novel Zn–Sn–Cu–Ni high-temperature solder containing a small amount of Al;Journal of Materials Science: Materials in Electronics;2023-08
2. Effect of Zinc Addition on the Evolution of Interfacial Intermetallic Phases at Near-Eutectic 50In-50Sn/Cu Interfaces;Journal of Electronic Materials;2019-12-01
3. High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders;Journal of Electronic Materials;2018-11-07
4. The microstructure and mechanical properties of Zn-25Sn-XAl (X=0–0.09wt%) high temperature lead free solder;Materials Science and Engineering: A;2016-11
5. Interfacial structure and growth kinetics of intermetallic compounds between Sn-3.5Ag solder and Al substrate during solder process;Journal of Alloys and Compounds;2016-10
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