Interfacial structure and growth kinetics of intermetallic compounds between Sn-3.5Ag solder and Al substrate during solder process-Reference-Cited by-同舟云学术

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Interfacial structure and growth kinetics of intermetallic compounds between Sn-3.5Ag solder and Al substrate during solder process

Published:2016-10 Issue: Volume:682 Page:627-633
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Yao Yao,Zhou Jian,Xue Feng,Chen Xu

Funder

National Natural Science Foundation of China

Scientific Research Foundation of Graduate School of Southeast University

Jiangsu Key Laboratory for Advanced Metallic Materials

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference31 articles.

1. Effect of Ni content on mechanical properties and corrosion behavior of Al/Sn-9Zn-Ni/Cu joints;Huang;J. Mater. Sci. Technol.,2012

2. Wetting of Cu and Al by Sn-Zn and Zn-Al eutectic alloys;Pstruś;J. Mater. Eng. Perform.,2012

3. Wetting of Al pads by Sn-8.8Zn and Sn-8.7Zn-1.5(Ag, In) alloys;Fima;J. Mater. Sci.,2014

4. Microstructure and interfacial reaction of Sn–Zn–x(Al,Ag) near-eutectic solders on Al and Cu substrates;Huang;J. Mater. Sci. Mater. Electron.,2014

5. Effect of the soldering process on the microstructure and mechanical properties of Sn-9Zn/Al solder joints;Yao;J. Mater. Eng. Perform.,2015

Cited by 31 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructure and properties of Sn-modified graphite film/Al laminated composites by hot press sintering;Diamond and Related Materials;2024-05

2. Linear growth behaviour of intermetallic compound layer in electronic interconnections;Science and Technology of Welding and Joining;2024-01-31

3. Effects of Nanosecond Laser Scanning Paths on Weld Formation, Microstructure and Mechanical Properties of Dissimilar Ultra-Thin Al/Cu Foil Nanosecond Laser Welded Joints;Journal of Materials Engineering and Performance;2023-10-18

4. Effect of Ag3Sn on Fracture Behaviors of Sn-3.5Ag Lead-Free Solder during In Situ Tensile Test at Low Temperature;Journal of Materials Engineering and Performance;2023-07-31

5. Comparative Study of Sn-based Solder Wettability on Aluminum Substrate;QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY;2023

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