Influence of diamond content and milling duration on microstructure and thermal conductivity of Ti-coated diamond/copper composite coating on copper substrate-Reference-Cited by-同舟云学术

Influence of diamond content and milling duration on microstructure and thermal conductivity of Ti-coated diamond/copper composite coating on copper substrate

Published:2021-02 Issue: Volume:259 Page:124017
ISSN:0254-0584
Container-title:Materials Chemistry and Physics
language:en
Short-container-title:Materials Chemistry and Physics

Author:

Sun Jing,Zang Jiajun,Li Huan,Feng Xiaomei,Shen Yifu

Funder

Foundation of the Graduate Innovation Center, Nanjing University of Aeronautics and Astronautics

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference41 articles.

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3. On the influence of active element content on the thermal conductivity and thermal expansion of Cu–X (X=Cr, B) diamond composites;Weber;Scripta Mater.,2007

4. Copper and its alloys thermal conductivity controlling with diamond and Ti or Cr addition;Prokhorov;Mater. Today,2018

5. Thermal conductivity of Cu-Ti/diamond composites via spark plasma sintering;Yang;Diam. Relat. Mater.,2019

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