Study on the preparation of ascorbic acid reduced ultrafine copper powders in the presence of different protectants and the properties of copper powders based on methionine protection-Reference-Cited by-同舟云学术

Study on the preparation of ascorbic acid reduced ultrafine copper powders in the presence of different protectants and the properties of copper powders based on methionine protection

Published:2024 Issue: Volume: Page:
ISSN:2516-0230
Container-title:Nanoscale Advances
language:en
Short-container-title:Nanoscale Adv.

Author:

Ke Xin¹²³,Xie Bingqing¹²³,Zhang Jingguo¹²⁴,Wang Jianwei¹⁵,Li Weiying²,Ban Liqing¹²,Hu Qiang¹²,He Huijun¹²,Wang Limin¹²,Wang Zhong¹²^ORCID

Affiliation:

1. Metal Powder Materials Industrial Technology Research Institute of China GRINM, Beijing 101407, China

2. GRIPM Advanced Materials Co. Ltd, Beijing 101407, China

3. General Research Institute for Nonferrous Metals, Beijing 100088, China

4. China Gricy Advanced Materials Co., Ltd, Chongqing 401431, China

5. GRINM NEXUSX Advanced Materials (Beijing) Co. Ltd, Beijing 101407, China

Abstract

By regulating the one-step secondary reduction process (Cu(ii) → CuCl(i) → Cu2O(i) → Cu(0)) is used to slow down the reaction rate and obtain high-performance ultrafine copper powder protected by methionine (Met).

Funder

National Key Research and Development Program of China

Publisher

Royal Society of Chemistry (RSC)

Subject

General Engineering,General Materials Science,General Chemistry,Atomic and Molecular Physics, and Optics,Bioengineering

Link

http://pubs.rsc.org/en/content/articlepdf/2024/NA/D3NA01146A

Reference32 articles.

1. Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices

2. Thermal interface material with graphene enhanced sintered copper for high temperature power electronics

3. Constructing Artificial Glass Nanobarrier Layer on Copper Spheres with Robust Antioxidation Properties for Printable Electrode

4. Progress of Interconnect Materials in the Third-generation Semiconductor and Their Low-temperature Sintering of Copper Nanoparticles