1. Advanced Materials for Thermal Management of Electronic Packaging;Tong,2011
2. Research progress in interface modification and thermal conduction behavior of diamond/metal composites;Zhu;Int. J. Min. Met. Mater.,2022
3. Fabrication of Cu-SiC composites using powder metallurgy technique;Somani;Mater. Today: Proc.,2018
4. Effect of graphite orientation distribution on thermal conductivity of Cu matrix composite;Yang;Mater. Chem. Phys.,2021
5. Influence of diamond content and milling duration on microstructure and thermal conductivity of Ti-coated diamond/copper composite coating on copper substrate;Sun;Mater. Chem. Phys.,2020