Optimization of sintering parameters for diamond–copper composites in conventional sintering and their thermal conductivity
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference29 articles.
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4. High thermal conductivity composite of diamond particles with tungsten coating in a copper matrix for heat sink application;Abyzov;Appl. Therm. Eng.,2012
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