Electrochemical investigation of the surface-modifying roles of guanidine carbonate in chemical mechanical planarization of tantalum

Author:

Rock S.E.,Crain D.J.,Zheng J.P.,Pettit C.M.,Roy D.

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference59 articles.

1. Chemical Mechanical Planarization: Slurry Chemistry, Materials, and Mechanisms

2. The International Technology Roadmap for Semiconductors: http://www.itrs.net/Links/2006Update/2006UpdateFinal.htm

3. J. Bian, K. Hu, H. Li, Z. Liu, J. Quanci, M.R. Vanhanehem, High-rate barrier polishing composition, United States Patent 7300480 (2007).

4. J. Bian, European Patent EP 1 490 897 B1 (2007).

5. Voltammetric current oscillations due to general and pitting corrosion of tantalum: Implications for electrochemical–mechanical planarization

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