Author:
Li Junyi,Zhang Ziyu,Zhu Tangwei,Li Zhuo,Wang Jun,Cheng Yuanrong
Funder
National Natural Science Foundation of China
Natural Science Foundation of Shanghai, China
National S&T Major Project of China
Subject
Organic Chemistry,Polymers and Plastics,General Physics and Astronomy,Materials Chemistry
Reference31 articles.
1. Low dielectric constant materials;Volksen;Chem. Rev.,2010
2. Low dielectric constant materials for ULSI interconnects;Morgen;Annu. Rev. Mater. Sci.,2000
3. S.J. Martin, J.P. Godschalx, M.E. Mills ME, E.O. Shaffer, P.H. Townsend, Development of a low-dielectric-constant polymer for the fabrication of integrated circuit interconnect, Adv. Mater. 12 (2000) 1769-1778.
4. High-performance ultralow dielectric constant carbon-bridged mesoporous organosilica films for advanced interconnects;Jiang;J. Mater. Chem. C,2014
5. In search of low-k dielectrics;Miller;Science,1999
Cited by
23 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献