The TSV process in the hybrid pixel detector for the High Energy Photon Source-Reference-Cited by-同舟云学术

The TSV process in the hybrid pixel detector for the High Energy Photon Source

Published:2020-11 Issue: Volume:980 Page:164425
ISSN:0168-9002
Container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
language:en
Short-container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Author:

Zhang Jie,Ding Ye,Wei Wei,Li Hangxu,Li Zhenjie,Ji Xiaolu,Jing Xiaoping,He Cong,Cao LiQiang,Jiang Xiaoshan,Zhu Kejun,Liu Peng,Chen Yuanbo

Funder

National Basic Research Program of China

Publisher

Elsevier BV

Subject

Instrumentation,Nuclear and High Energy Physics

Reference13 articles.

1. Design and first characterization of active and slim-edge planar detectors for FEL applications;Benkechkache;IEEE Trans. Nucl. Sci.,2017

2. Towards a new generation of pixel detector readout chips;Campbell;J. Instrum.,2016

3. The FE-i4 pixel readout integrated circuit;Garcia-Sciveres;Nucl. Instrum. Methods Phys. Res. A,2011

4. Advanced through silicon vias for hybrid pixel detector modules;Hügging;Nucl. Instrum. Methods Phys. Res. A,2019

5. Development of a four-side buttable x-ray detection module with low dead area using the ufxc32k chips with TSVs;Kasinski;IEEE Trans. Nucl. Sci.,2017

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1. A study of the latest updates of the readout system for the hybird-pixel detector at HEPS;Journal of Instrumentation;2024-06-01

2. Technology for Manufacturing TSV Structures for the Creation of Silicon Interposers Using Temporary-Bonding Technology;Nanobiotechnology Reports;2024-04

3. Research advances on X-ray pixel detectors;Chinese Science Bulletin;2022-06-21

4. Characterisation of the HEXITEC4S X-ray spectroscopic imaging detector incorporating through-silicon via (TSV) technology;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2022-02

5. A Dual Module Parallel Readout System Based on 10 Gb TCP/IP Transmission for HEPS-BPIX Detector;IEEE Transactions on Nuclear Science;2021-11