Characterisation of the HEXITEC4S X-ray spectroscopic imaging detector incorporating through-silicon via (TSV) technology-Reference-Cited by-同舟云学术

Characterisation of the HEXITEC4S X-ray spectroscopic imaging detector incorporating through-silicon via (TSV) technology

Published:2022-02 Issue: Volume:1025 Page:166083
ISSN:0168-9002
Container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
language:en
Short-container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Author:

Veale M.C.^ORCID,Booker P.,Church I.,Jones L.L.,Lipp J.,Schneider A.,Seller P.,Wilson M.D.,Chsherbakov I.,Kolesnikova I.,Lozinskaya A.,Novikov V.,Tolbanov O.,Tyazhev A.,Zarubin A.

Publisher

Elsevier BV

Subject

Instrumentation,Nuclear and High Energy Physics

Reference30 articles.

1. HEXITEC ASIC—A pixellated readout chip for CZT detectors;Jones;Nucl. Instrum. Methods A,2009

2. HEXITEC: A High-energy X-ray spectroscopic imaging detector for synchrotron applications;Veale;Synchron. Radiat. News,2018

3. Development of a multi-detector readout circuitry for ultrahigh energy resolution single-photon imaging applications;Zannoni;Nucl. Instrum. Methods A,2020

4. An operando spatially resolved study of alkaline battery discharge using a novel hyperspectral detector and X-ray tomography;Connolley;J. Appl. Cryst.,2020

5. A 10 cm × 10 cm CdTe spectroscopic imaging detector based on the HEXITEC ASIC;Wilson;J. Instrum.,2015

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