Investigation on the brazing mechanism and machining performance of diamond wire saw based on Cu-Sn-Ti alloy
Author:
Funder
Collaborative Innovation Program of Industry University Research of Jiangsu Province
Publisher
Elsevier BV
Subject
General Medicine
Reference26 articles.
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2. Experimental investigation on the machining characteristics of single-crystal SiC sawing with the fixed diamond wire;Huang;Int. J. Adv. Manuf. Technol.,2015
3. Effect of initial deflection of diamond wire on thickness variation of sapphire wafer in multi-wire saw;Kim;Int. J. Prec. Eng. Manufact. Green Technol.,2015
4. Investigations of double layer UV-curing resin diamond wire saw;Yao,2016
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