Exploring the role of indium on the microstructure evolution and interface bonding behavior of brazing diamond abrasive with modified Cu–Sn–Ti

Author:

Cui Bing,Liu Zhengwei,Du Quanbin,Deng Hailiang,Yang Li

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Materials Chemistry,Mechanical Engineering,General Chemistry,Electronic, Optical and Magnetic Materials

Reference40 articles.

1. Diamond abrasive based cutting tool for processing of advanced engineering materials: a review[J];Shekhar;Materials Today: Proceedings.,2020

2. Filler metals, brazing processing and reliability for diamond tools brazing: a review[J];Zhang;J. Manuf. Process.,2021

3. Microstructure and performance of brazed diamonds with multilayer graphene-modified cu–Sn–Ti solder alloys[J];Duan;Ceram. Int.,2021

4. Interfacial characteristics of titanium coated micro-powder diamond abrasive tools fabricated by electroforming-brazing composite process[J];Shen;Int J Refract Met H.,2019

5. The brazing of diamond[J];Sung;Int J Refract Met H,2009

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