Solder Volume Effect on Interfacial Reaction between Sn-Ag-Cu/ENImAg Substrate
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics
Reference27 articles.
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3. J. Yoon and S. Jung, “Interfacial reactions between Sn – 0 . 4Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction,” Alloy. Compd., vol. 396, pp. 122-127, 2005.
4. A. Ourdjini, M.A. Azmah Hanim, I. Siti Rabiatull Aisha, and Y. T. Chin, “Effect of surface finish metallurgy on intermetallic compounds during soldering with tin-silver-copper solders,” in Proc. of the Int. Conf. on Electron. Manuf. Technol. (IEMT) Symp., 2008, pp. 2-5.
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Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies;Journal of Materials Research and Technology;2023-07
2. Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder;Journal of Materials Science: Materials in Electronics;2022-05-18
3. The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces;Soldering & Surface Mount Technology;2020-07-14
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