Effect of carbide formers on microstructure and thermal conductivity of diamond-Cu composites for heat sink materials

Author:

XIA Yang,SONG Yue-qing,LIN Chen-guang,CUI Shun,FANG Zhen-zheng

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference19 articles.

1. Manufacturing and applications of diamond composites for thermal management [R];WILDNER,2006

2. Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications [J];SCHUBERT;Mater Sci Eng A,2008

3. Thermal conductivity of metal-matrix composites [J];DAVIS;J Appl Phys,1995

4. Thermal properties of diamond/ copper composites materials [J];YOSHIDA;Microelectronics Reliability,2004

5. Thermal conductivity of diamond composites [J];DINWIDDIE;Thermal Conductivity,1994

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