Interface improvement of diamond/copper composites through a low-temperature high-efficiency coating method-Reference-Cited by-同舟云学术

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Interface improvement of diamond/copper composites through a low-temperature high-efficiency coating method

Published:2024-09 Issue: Volume:804 Page:140486
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Wei Chenlong^ORCID,Wang Xuexiang^ORCID,Wen Jun,Wang Qiang^ORCID,Donga Zhaoshi^ORCID

Publisher

Elsevier BV

Reference31 articles.

1. Facile electroless copper plating on diamond particles without conventional sensitization and activation;Wei;Adv. Powder Technol,2019

2. Thermal expansion behaviour and dimensional stability of Diamond/Cu composites with different diamond content;Xie;J. Alloys. Compd,2019

3. Effect of tungsten based coating characteristics on microstructure and thermal conductivity of diamond/Cu composites prepared by pressueless infiltration;Jia;Ceram. Int,2019

4. Mechanical properties of a diamond-copper composite with high thermal conductivity;Abyzov;Mater. Des,2015

5. Influence of the grain size of CVD diamond on the thermal conductivity, material removal depth and surface roughness in nanosecond laser machining;Li;Ceram. Int,2020

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