Facile electroless copper plating on diamond particles without conventional sensitization and activation-Reference-Cited by-同舟云学术

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Facile electroless copper plating on diamond particles without conventional sensitization and activation

Published:2019-11 Issue:11 Volume:30 Page:2751-2758
ISSN:0921-8831
Container-title:Advanced Powder Technology
language:en
Short-container-title:Advanced Powder Technology

Author:

Wei Chenlong,Cheng Jigui,Chen Pengqi,Wei Bangzheng,Gao Dalu,Xu Dang

Funder

National Natural Science Foundation of China

Natural Science Foundation of Anhui

Fundamental Research Funds for Central Universities

Publisher

Elsevier BV

Subject

Mechanics of Materials,General Chemical Engineering

Reference35 articles.

1. Man-made diamonds;Bundy;Nature,1955

2. Diamond micropowder synthesis via graphite etching in a microwave hydrogen plasma;Yao;Powder Technol.,2017

3. Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications;Schubert;Scr. Mater.,2008

4. Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications;Schubert;Mater. Sci. Eng.,2008

5. Synthesis of micro- or nano-crystalline diamond films on WC-Co substrates with various pretreatments by hot filament chemical vapor deposition;Wei;Appl. Surf. Sci.,2010

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2. Production of Cu/Diamond Composite Coatings and Their Selected Properties;Materials;2024-06-08

3. Electroless plating catalyzed by 3D Cu NWs arrays on insulating substrate with enhanced adhesion;Journal of Materials Science;2024-05-22

4. A review of diamond synthesis, modification technology, and cutting tool application in ultra-precision machining;Materials & Design;2024-01

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