Electroless plating catalyzed by 3D Cu NWs arrays on insulating substrate with enhanced adhesion
Author:
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s10853-024-09736-9.pdf
Reference30 articles.
1. Fuh YK, Lee SC, Tsai CY (2017) Application of highly flexible self-powered sensors via sequentially deposited piezoelectric fibers on printed circuit board for wearable electronics devices. Sens Actuators Phys 268:148–154
2. Zhu Y, Zhao T, Sun F, Jia C, Ye H et al (2023) Multi-functional triboelectric nanogenerators on printed circuit board for metaverse sport interactive system. Nano Energy 113:108520
3. Siva Rama Krishna L, Srikanth PJ (2021) Evaluation of environmental impact of additive and subtractive manufacturing processes for sustainable manufacturing. Mater Today Proc 45:3054–3060
4. Tipton RB, Hou D, Shi Z et al (2021) Optical interconnects on a flexible substrate by multi-material hybrid additive and subtractive manufacturing. Addit Manuf 48:102409
5. Dou W, Peng X, Kong L, Xingyun H (2022) Removal of Cu(II) and Cu(I) from acidic copper etching wastewater by NH3·H2O decomplexation coupling with O2 oxidation. Sep Purif Technol 285:120348
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