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Thermal expansion behaviour and dimensional stability of Diamond/Cu composites with different diamond content

  • Published:2019-08 Issue: Volume:797 Page:122-130
  • ISSN:0925-8388
  • Container-title:Journal of Alloys and Compounds
  • language:en
  • Short-container-title:Journal of Alloys and Compounds

Author:

Xie Zhongnan,Guo Hong,Zhang Zhen,Zhang Ximin

Funder

National Key R&D Program of China

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference45 articles.

1. Electronic Packaging Materials: Properties and Selection;Memis,2001

2. Influence of reinforcement contiguity on the thermal expansion of alumina particle reinforced aluminium composites: dedicated to Professor Dr. H.-P. Degischer on the occasion of his 65th birthday;Roudini;Int. J. Mater. Res.,2010

3. Review of applications and developments of ultra-thin micro heat pipes for electronic cooling;Tang;Appl. Energy,2018

4. Thermal properties of diamond/copper composite material;Yoshida;Microelectron. Reliab.,2004

5. Thermal Stresses and Thermal Expansion in Metal Matrix Composites;Delannay,2018
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