Thermal properties of diamond/copper composite material-Reference-Cited by-同舟云学术

Thermal properties of diamond/copper composite material

Published:2004-02 Issue:2 Volume:44 Page:303-308
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Yoshida Katsuhito,Morigami Hideaki

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference12 articles.

1. Microelectronics packaging handbook;Tummala,1989

2. Simultaneous quantification of strain and defects in high-power diode laser devices;Tomm;Appl. Phys. Lett.,2002

3. Advanced materials for optoelectronic packaging;Zweben;Electron. Packaging Prod.,2002

4. Nonmetallic crystals with high thermal conductivity;Slack;J. Phys. Chem. Solids,1973

5. Lorenzen D, Hennig P. Highly thermally conductive substrates with adjustable CTE for diode laser bar packaging. In: Proc. SPIE 4945, 2003. p. 174–85

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