Interfacial structures and their effect on thermal conductivity and mechanical properties of diamond/Cu−B composites
Author:
Funder
National Key Research and Development Program of China
Publisher
Elsevier BV
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Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Preparation and Property Modulation of Multi-Grit Diamond/Aluminum Composites Based on Interfacial Strategy;Metals;2024-07-09
2. Preparation of micro-diamond/copper composite foils by direct current electro-deposition method and its properties;Diamond and Related Materials;2024-05
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