An explicit analytical model for rapid computation of temperature field in a three-dimensional integrated circuit (3D IC)

Author:

Choobineh Leila,Jain Ankur

Funder

National Science Foundation

Publisher

Elsevier BV

Subject

General Engineering,Condensed Matter Physics

Reference29 articles.

1. 3-D ICs: a novel chip design for improving deep submicron interconnect performance and systems-on-chip integration;Banerjee;Proc. IEEE,2001

2. Three-dimensional integrated circuits and the future of system-on-chip designs;Patti;Proc. IEEE,2006

3. Processor design in three-dimensional die-stacking technologies;Loh;IEEE Micro,2007

4. Three-dimensional integrated circuits;Topol;IBM J. Res. Dev.,2006

5. Is 3D integration an opportunity or just a hype?;Li,2010

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