Author:
Krishnan Girish,Jain Ankur
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference29 articles.
1. A review of recent research on heat transfer in three-dimensional integrated circuits (3-D ICs);Salvi;IEEE Trans. Compon. Packag. Manuf. Technol.,2021
2. Thermal management of microelectronics in the 21st century;Bar-Cohen,1997
3. Cooling a microprocessor chip;Mahajan;Proc. IEEE.,2006
4. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Dev. Lett.,1981
5. Immersion cooling nucleate boiling of high power computer chips;El-Genk;Energy Convers. Manag.,2012