Author:
Loh Gabriel H.,Xie Yuan,Black Bryan
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Cited by
134 articles.
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1. At the Locus of Performance: Quantifying the Effects of Copious 3D-Stacked Cache on HPC Workloads;ACM Transactions on Architecture and Code Optimization;2023-12-14
2. Into the Third Dimension: Architecture Exploration Tools for 3D Reconfigurable Acceleration Devices;2023 International Conference on Field Programmable Technology (ICFPT);2023-12-12
3. Thermal coupling analysis and improved dynamic temperature control algorithm for 3D-LSI;2023 International Technical Conference on Circuits/Systems, Computers, and Communications (ITC-CSCC);2023-06-25
4. A Robust Integrated Power Delivery Methodology for 3-D ICs;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-03
5. High Bandwidth Thermal Covert Channel in 3-D-Integrated Multicore Processors;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2022-11