High Bandwidth Thermal Covert Channel in 3-D-Integrated Multicore Processors-Reference-Cited by-同舟云学术

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High Bandwidth Thermal Covert Channel in 3-D-Integrated Multicore Processors

Published:2022-11 Issue:11 Volume:30 Page:1654-1667
ISSN:1063-8210
Container-title:IEEE Transactions on Very Large Scale Integration (VLSI) Systems
language:
Short-container-title:IEEE Trans. VLSI Syst.

Author:

Dhananjay Krithika¹^ORCID,Pavlidis Vasilis F.²^ORCID,Coskun Ayse K.³^ORCID,Salman Emre¹^ORCID

Affiliation:

1. Department of Electrical and Computer Engineering, Stony Brook University (SUNY), Stony Brook, NY, USA

2. Department of Electrical and Computer Engineering, Aristotle University of Thessaloniki, Thessaloniki, Greece

3. Department of Electrical and Computer Engineering, Boston University, Boston, MA, USA

Funder

National Science Foundation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

https://ieeexplore.ieee.org/ielam/92/9925603/9896839-aam.pdf

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhanced Detection of Thermal Covert Channel Attacks in Multicore Processors;2024 25th International Symposium on Quality Electronic Design (ISQED);2024-04-03

2. Information-Theoretic Perspective to Thermal Covert Channels;2023 IEEE International Symposium on Circuits and Systems (ISCAS);2023-05-21

3. Covert Channel Communication as an Emerging Security Threat in 2.5D/3D Integrated Systems;Sensors;2023-02-13

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