1. Chemical Mechanical Polishing in Silicon Processing;Li,2000
2. Berman, M., Bibby, T., Smith, A., 1998, Review of In Situ & In-line Detection for CMP Applications, Semiconductor Fabtech, 8th edition: 267-274
3. Broadband optical end-point detection for linear chemical-mechanical planarization (CMP) process using image matching technique;Yi;Mechatronics,2005
4. Process Control and Monitoring with Laser Interferometry Based Endpoint Detection in Chemical Mechanical Planarization;Chan;IEEE/ASMC,1998
5. Signal analysis of the end point detection method based on motor current;Kim;Microelectronic Engineering,2005