Broadband optical end-point detection for linear chemical–mechanical planarization (CMP) processes using an image matching technique-Reference-Cited by-同舟云学术

Broadband optical end-point detection for linear chemical–mechanical planarization (CMP) processes using an image matching technique

Published:2005-04 Issue:3 Volume:15 Page:271-290
ISSN:0957-4158
Container-title:Mechatronics
language:en
Short-container-title:Mechatronics

Author:

Yi Jingang,Xu C. Shan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanical Engineering,Control and Systems Engineering

Reference6 articles.

1. Hetherington DL, Stein DJ. Recent advances in endpoint and in-line monitoring techniques for chemical–mechanical polishing processes. In: Proceedings of CMP-MIC Conference, Santa Clara, CA, 2001. p. 315–23

2. Endpoint detection for CMP;Bibby;J Electron Mater,1998

3. Empirical-based modeling for control of CMP removal uniformity;Jensen;Solid State Technol,2001

4. Comparing images using the Hausdorff distance;Huttenlocher;IEEE Trans Pattern Anal Machine Intell,1993

5. Maximum-likelihood image matching;Olson;IEEE Trans Pattern Anal Machine Intell,2002

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