Endpoint detection for CMP-Reference-Cited by-同舟云学术

Endpoint detection for CMP

Published:1998-10 Issue:10 Volume:27 Page:1073-1081
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Bibby Thomas,Holland Karey

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-998-0140-1.pdf

Reference26 articles.

1. H. Litvak, Proc. First Intl. Dielectrics for VLSI/ULSI Multi-level Interconnection Conference (DUMIC), Santa Clara, CA, February 21–22, 1995.

2. T. Bibby, R. Harwood, D. Schey and K. McKinley, Thin Solid Films 308–309, 512 (1997).

3. L. Schultz, U.S. Patent #5,081,796, Jan. 21, 1992.

4. M. Sun, H.-M. Tseng, H. Litvak and D. Glenn, First Intl. Chemical-Mechanical Polish (CMP) for ULSI Multilevel Interconnection Conf., February 22–23, 1996, p. 256.

5. I. Katakabe, N. Miyashita and T. Akiyama, U.S. Patent #5,643,046, July 1, 1997.

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