Cartesian coordinate maps for chemical mechanical planarization uniformity characterization-Reference-Cited by-同舟云学术

Cartesian coordinate maps for chemical mechanical planarization uniformity characterization

Published:1997-10 Issue: Volume:308-309 Page:512-517
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Bibby Thomas F.A,Harwood Randy,Schey Dennis,McKinley Kevin

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. T. McHugh and P. Mumola, `Visualizing film thickness via whole-wafer imaging', Solid State Technol., (1996) S11.

2. O'Mara, Planarization by Chemical-Mechanical Polishing for Multilevel Metal Integrated Circuits, O'Mara and Associates, Palo Alto, CA, 1994.

3. K. Holland and T. Bibby, Planarization by CMP for ULSI Applications, Taiwan IC Tech. Conf., add., 1995, p. 11.

4. K. Holland, T. Bibby, L. Williams, R. Cruz, J. Lee, B. Kraus, P. Parikh and D. Levedakis, Chemical mechanical polishing of high density plasma deposited oxides for planarized interlevel dielectric, Sernicon-Japan, 1995.

5. G. Dishon and M. Finarov, Monitoring Choices of CMP Planarization Processes, Proc. Second Ann. Chem.-Mechan. Pol. (CMP) for ULSI Multilevel Interconnect. Conf., 1997, 391.

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