Process state estimation in chemical mechanical polishing (CMP) by inverse analysis of in-process data
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference11 articles.
1. Multi-sensor Monitoring System in Chemical Mechanical Planarization (CMP) for Correlations with Process Issues;Jeong;Cirp Annals,2006
2. A Deep Learning-based Approach to Material Removal Rate Prediction in Polishing;Wang;Cirp Annals,2017
3. A Two-stage Clustered Multi-task Learning Method for Operational Optimization in Chemical Mechanical Polishing;Duan;Journal of Process Control,2015
4. The Theory and Design of Plate Glass Polishing Machines;Preston;Journal of the Society of Glass Technology,1927
5. Mechanisms of the Chemical Mechanical Polishing (CMP) Process in Integrated Circuit Fabrication;Saka;Cirp Annals,2001
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Trivalent lanthanum and ytterbium doped meso-silica/ceria abrasive systems toward chemical mechanical polishing (CMP) and ultraviolet irradiation-assisted photochemical mechanical polishing (PCMP);Applied Surface Science;2024-06
2. Real-time prediction of material removal rate for advanced process control of chemical mechanical polishing;CIRP Annals;2024
3. ものづくりの未来を拓くデジタル生産工学の研究;Journal of the Japan Society for Precision Engineering;2023-03-05
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