Current density and line width effects in electromigration: a new damage-based lifetime model
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference53 articles.
1. Blech, I. A. and Sello, H., in Physics of Failures in Electronics, Rome Air Development Center, 1966, Vol. 5, p. 496
2. Electromigration—A brief survey and some recent results
3. Electromigration and IC Interconnects
4. Grain size dependence of electromigration‐induced failures in narrow interconnects
5. Electromigraton activation energy dependence on AlCu interconnect linewidth and microstructure
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