Electromigraton activation energy dependence on AlCu interconnect linewidth and microstructure
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.107161
Reference11 articles.
1. A model for the width dependence of electromigration lifetimes in aluminum thin‐film stripes
2. Linewidth dependence of electromigration in evaporated Al‐0.5%Cu
3. Electromigration lifetime sudies of submicrometer-linewidth Al-Cu conductors
4. ELECTROMIGRATION IN SINGLE‐CRYSTAL ALUMINUM FILMS
5. Monte Carlo calculations of structure‐induced electromigration failure
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