TEM study of the interface of anodic-bonded Si/glass
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference12 articles.
1. Anodic bonding of evaporated glass structured with lift-off technology for hermetical sealing
2. Low-temperature anodic bonding using lithium aluminosilicate-β-quartz glass ceramic
3. Rate Processes during Anodic Bonding
4. Field Assisted Glass‐Metal Sealing
5. Dielectric isolation of silicon by anodic bonding
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1. Effect of Surface Cleaning Process on the Wafer Bonding of Silicon and Pyrex Glass;Journal of Inorganic and Organometallic Polymers and Materials;2023-01-12
2. Effect of rare earth oxide CeO2 on the anodic bonding performance of PEG-based MEMS encapsulation materials;Advances in Mechanical Engineering;2021-03
3. Modeling of anodic bonding with SiO2 dielectric as interlayer;Journal of Micromechanics and Microengineering;2020-07-09
4. Effect of application of opposite polarity voltage on interface separation of anodically bonded kovar alloy–borosilicate glass joints;Sensors and Actuators A: Physical;2019-09
5. Low-temperature direct bonding of Si and quartz glass using the APTES modification;Ceramics International;2019-09
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