Low-temperature anodic bonding using lithium aluminosilicate-β-quartz glass ceramic-Reference-Cited by-同舟云学术

Low-temperature anodic bonding using lithium aluminosilicate-β-quartz glass ceramic

Published:1998-01 Issue:1 Volume:64 Page:95-100
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Shoji Shuichi,Kikuchi Hiroto,Torigoe Hirotaka

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. Silicon fusion bonding for fabrication of sensors, actuators and microstructures;P.W.;Sensors and Actuators,1990

2. Bonding techniques for microsensors;Ko,1985

3. Silicon-to-silicon anodic bonding;Hanneborg,1990

4. Hermeticity testing of glass-silicon packages with on-chip feedthroughs;Von Arx,1995

5. Bonding and assembling methods for realizing a μTAS;Shoji,1994

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