Affiliation:
1. Fraunhofer Institute for Photonic Microsystems IPMS Center Nanoelectronic Technologies (CNT) An der Bartlake 5 01109 Dresden Germany
2. Université Grenoble Alpes, CEA‐Leti F‐38000 Grenoble France
3. Institute of Analytical Chemistry TU Bergakademie Freiberg Leipziger Str. 29 09599 Freiberg Germany
Abstract
Due to the increasing number of application fields using lithium compounds in the microelectronics sector, it is necessary to investigate the contamination influence and the effects of lithium on silicon and silicon oxide. To be able to use lithium in a controlled manner in complementary metal–oxide–semiconductor clean room environments, the various diffusion effects during an important process in semiconductor manufacturing, the thermal oxidation of silicon to form silicon oxide, are investigated herein. This includes the diffusion within the wafer, between wafers, and into the furnace environment. For this purpose, wafers are intentionally contaminated, oxidized, and then analyzed with vapor phase decomposition inductively coupled plasma mass spectrometry. The results of this study are correlated with typical contamination levels in state‐of‐the‐art cleanroom facilities to enable classifications of the results for the semiconductor sector. Furthermore, the effect on the growth rate and uniformity of silicon oxide is evaluated by ellipsometry and topography measurements. Finally, electrical measurements of the oxide layer have shown that there is a significant influence on the silicon oxide quality, meaning that lithium can have a detrimental effect on devices.
Funder
Horizon 2020 Framework Programme