Plasma-activated silicon–glass high-strength multistep bonding for low-temperature vacuum packaging-Reference-Cited by-同舟云学术

Plasma-activated silicon–glass high-strength multistep bonding for low-temperature vacuum packaging

Published:2023-09 Issue: Volume:471 Page:144719
ISSN:1385-8947
Container-title:Chemical Engineering Journal
language:en
Short-container-title:Chemical Engineering Journal

Author:

Yu Mingzhi^ORCID,Zhao Libo,Wang Yongliang,Xia Yong,Ma Yintao,Wang Yanbin,Han Xiangguang,Chen Yao,Lu Shun,Luo Guoxi^ORCID,Zhu Nan^ORCID,Yang Ping,Wang Kaifei,Lin Qijing,Jiang Zhuangde

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,General Chemical Engineering,Environmental Chemistry,General Chemistry

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