Plasma-activated silicon–glass high-strength multistep bonding for low-temperature vacuum packaging

Author:

Yu MingzhiORCID,Zhao Libo,Wang Yongliang,Xia Yong,Ma Yintao,Wang Yanbin,Han Xiangguang,Chen Yao,Lu Shun,Luo GuoxiORCID,Zhu NanORCID,Yang Ping,Wang Kaifei,Lin Qijing,Jiang Zhuangde

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,General Chemical Engineering,Environmental Chemistry,General Chemistry

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