Anodic bonding of evaporated glass structured with lift-off technology for hermetical sealing-Reference-Cited by-同舟云学术

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Anodic bonding of evaporated glass structured with lift-off technology for hermetical sealing

Published:2000-05 Issue:1-3 Volume:83 Page:150-155
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Sassen S,Kupke W,Bauer K

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Semiconductor Wafer Bonding;Tong,1999

2. Bonding Techniques for Microsensors, Micromachining and Micropackaging of Transducers;Ko,1985

3. Sensor Technology and Devices;Ristic,1994

4. Silicon Sensors;Middelhoek,1989

5. Wafer bonding with an adhesive coating;Klink;SPIE,1998

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1. Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices;Micromachines;2023-06-24

2. Anodic bonding;Handbook of Silicon Based MEMS Materials and Technologies;2020

3. Wafer Bonding;Reference Module in Materials Science and Materials Engineering;2016

4. Anodic Bonding;Handbook of Silicon Based MEMS Materials and Technologies;2015

5. Anodic bonding of activated tin solder alloys in the liquid state: A novel large-area hermetic glass sealing method;Solar Energy Materials and Solar Cells;2011-11

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