Wafer bonding with an adhesive coating
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SPIE
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. The design of a near backscattering detection device for surface morphology of spherically bent crystal analyzer;Advanced Optical Manufacturing Technologies and Applications 2022; and 2nd International Forum of Young Scientists on Advanced Optical Manufacturing (AOMTA and YSAOM 2022);2023-01-09
2. Construction of a spherically bent crystal analyzer through anodic bonding for a non-resonant inelastic X-ray scattering spectrometer;Instrumentation Science & Technology;2021-04-14
3. Temporary Wafer Bonding and Debonding for 3D Integration Using an Electrochemically Active Polymer Adhesive;ECS Journal of Solid State Science and Technology;2014
4. Development of a microfluidic biosensor for detection of environmental mycobacteria;Sensors and Actuators B: Chemical;2007-04-10
5. Adhesive wafer bonding;Journal of Applied Physics;2006-02
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