Author:
Chiu Yu-Fang,Tsai Ying-Ling,Hwang Weng-Sing
Subject
Applied Mathematics,Modeling and Simulation
Reference13 articles.
1. G.K. Mui, X. Wu, K.X. Hu, C.P. Yeh, K. Wyatt, Solder Joint Formation Simulation and Finite Element Analysis, Electronic Components and Technology Conference, 1997, pp. 436–443
2. Solder bump size and shape modeling and experimental validation;Pfeifer;IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B,1997
3. Thermal fatigue life prediction of flip chip solder joints by fracture mechanics method;Lau,1992
4. R. Dudek, M. Nylen, A. Schubert, B. Michel, H. Reichl, An Efficient Approach to Predict Solder Fatigue Life and its Application to SM- and Area Array Components, Electronic Components and Technology Conference, 1997, pp. 462–471
5. Three-dimensional creep analysis of solder joints in surface mount devices;Bhatti;Transactions of the ASME, Journal of Electronic Packaging,1995
Cited by
14 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献