Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices-Reference-Cited by-同舟云学术

Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices

Published:1995-03-01 Issue:1 Volume:117 Page:20-25
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Bhatti Pardeep K.¹,Gschwend Klaus¹,Kwang Abel Y.¹,Syed Ahmer R.¹

Affiliation:

1. Delco Electronics Corporation, GM Hughes Electronics, Kokomo, IN 46904

Abstract

Three-dimensional finite element analysis has been applied for determining time-dependent solder joint response of leaded surface mount components under thermal cycling. Two main challenges are the geometric complexity in mesh development and computationally intensive analysis because of the highly nonlinear material properties. Advanced techniques have been applied, including multi-point constraints for mesh transition, which reduces the number of degrees of freedom in the model, and substructuring, which effectively reduces computational time in the iterative analysis. The result is a generic approach for nonlinear creep analysis using commercial FEA software on a high performance workstation. Illustrations are provided for J and gullwing leaded packages.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/117/1/20/5530724/20_1.pdf

Reference33 articles.

1. Steinberg, D. S., Cooling Techniques for Electronic Equipment, Wiley, New York, 1991.

2. Hagge, J. K., “Predicting Fatigue Life of Leadless Chip Carriers Using Manson-Coffin Equations,” Proceedings of the International Electronics Packaging Society Conference, 1982, pp. 199–206.

3. Engelmaier, W., “Functional Cycling and Surface Mounting Attachment Reliability,” Surface Mount Technology Technical Monograph Series 6984-002, ISHM, 1984, pp. 87–114.

4. Engelmaier W. , “Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-6, No. 3, Sept. 1983, pp. 232–237.

5. Stone, D., Wilson, H., Subrahmanyan, R., and Li, C., “Mechanisms of Damage Accumulation in Solders During Thermal Fatigue,” Proceedings of the 36th Electronic Components Conference, 1986, pp. 630–635.

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. CFD Investigation of the Soldering Process for a Small Spherical PCM Made of Lead-tin Alloy;International Journal of Mechanics;2023-03-03

2. Thermal Stresses in Flip Chip BGA Packaging;Encyclopedia of Thermal Stresses;2014

3. Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution;Modeling and Simulation for Microelectronic Packaging Assembly;2011-09-02

4. A unified viscoplastic description of 63Sn-37Pb solder alloy under cyclic straining and stressing;Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science;2004-09-01

5. Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead–tin alloy solder joint in electronics packaging;Applied Mathematical Modelling;2003-07