Thermal Stresses in Flip Chip BGA Packaging

Author:

Fan Xuejun,Bhatti Pardeep K.,Pei Min

Publisher

Springer Netherlands

Reference16 articles.

1. Lee WW, Nguyen LT, Selvaduray GS (2000) Solder joint fatigue models: review and applicability to chip scale packages. Microelectron Reliab 40:231–244

2. Fan X, Pei M, Bhatti PK (2006) Effect of finite element modeling techniques on solder joint fatigue life prediction of flip-chip BGA packages, ECTC 2006

3. Bhatti PK, Pei M, Fan X (2006) Effect of compressive preload on solder joint reliability of FC-BGA packages, ECTC 2006

4. Wong B, Helling DE, Clark RW (1988) A creep-rupture model for two-phase eutectic solders. IEEE Trans CMPT 11(3):284–290

5. Bhatti PK, Gschwend K, Kwang AY, Syed AR (1995) Three-dimensional creep analysis of solder joints in surface mount devices. ASME J Electron Packag 117:20–26

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