A unified viscoplastic description of 63Sn-37Pb solder alloy under cyclic straining and stressing-Reference-Cited by-同舟云学术

A unified viscoplastic description of 63Sn-37Pb solder alloy under cyclic straining and stressing

Published:2004-09-01 Issue:9 Volume:218 Page:909-920
ISSN:0954-4062
Container-title:Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science
language:en
Short-container-title:Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science

Author:

Yang X J¹,Chow C L¹,Lau K J²

Affiliation:

1. University of Michigan-Dearborn Department of Mechanical Engineering Dearborn, Michigan, USA

2. Hong Kong Polytechnic University Department of Mechanical Engineering Hong Kong, People's Republic of China

Abstract

A unified viscoplastic constitutive model for the fatigue life prediction of solder alloy 63Sn-37Pb is presented. The model incorporates the strain rate effect, the creep-plastic interaction and the dwell time effect under cyclic strain and stress loading. The applicability of this constitutive model is examined with cyclic strain tests with different strain rates, and cyclic stress tests under different stress waveforms in order to verify the progressive viscoplastic deformation of 63Sn-37Pb solder alloy. The investigation reveals that the material constants in the constitutive model can be determined by performing simple tests such as creep and cyclic tension-compression loading. The predictions using the constitutive model are found to agree well with the experimental results of the solder alloy under different loading. The agreement demonstrates that the model can satisfactorily describe the viscoplastic deformation behaviour under cyclic strain loading or stress loading.

Publisher

SAGE Publications

Subject

Mechanical Engineering

Link

http://journals.sagepub.com/doi/pdf/10.1243/0954406041991279

Reference34 articles.

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4. A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects

5. Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity

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