Fin Design Topology Optimization for Direct Liquid Cooling of Multichip Power Modules-Reference-Cited by-同舟云学术

Fin Design Topology Optimization for Direct Liquid Cooling of Multichip Power Modules

Published:2024-05 Issue:5 Volume:14 Page:795-809
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Lad Aniket Ajay¹^ORCID,Roman Eric¹,Zhao Yue²^ORCID,King William P.¹^ORCID,Miljkovic Nenad¹^ORCID

Affiliation:

1. Department of Mechanical Science and Engineering, University of Illinois, Urbana-Champaign, Urbana, IL, USA

2. Department of Electrical Engineering, University of Arkansas, Fayetteville, AR, USA

Funder

Power Optimization of Electro-Thermal Systems (POETS) National Science Foundation Engineering Research Center

Advanced Research Project Agency-Energy

International Institute for Carbon Neutral Energy Research

Ministry of Education, Culture, Sports, Science and Technology

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

Reference53 articles.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献