The role of dipotassium ethylenediaminetetraacetic acid and potassium oleate on chemical mechanical planarization relevant to heterogeneous materials of cobalt interconnects-Reference-Cited by-同舟云学术

The role of dipotassium ethylenediaminetetraacetic acid and potassium oleate on chemical mechanical planarization relevant to heterogeneous materials of cobalt interconnects

Published:2023-06 Issue: Volume:160 Page:107410
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Zhang Lifei^ORCID,Wang Tongqing,Wang Shuhui,Lu Xinchun

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference22 articles.

1. On-chip wiring for VLSI: status and directions;Small;IBM J. Res. Dev.,1990

2. Size-dependent resistivity in nanoscale interconnects;Josell;Annu. Rev. Mater. Res.,2009

3. Lower limits of line resistance in back end of line Cu interconnects;Hegde;Appl. Phys. Lett.,2016

4. Cobalt Fill for Advanced Interconnects;Bekiaris,2017

5. Amorphous Co-ti Alloy as a Single Layer Barrier for Co Local Interconnect Structure;Hosseini,2016

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation into atomistic reaction between abrasive and Co in H2O through ReaxFF MD and XPS;Tribology International;2025-01

2. Three anionic surfactants for corrosion inhibition in cobalt CMP: Research on validity and mechanism;Surfaces and Interfaces;2024-04

3. Developing an Efficient Forward Design Method for Co Post-CMP Cleaning Formulations Based on Nanoparticle Removal Mechanisms;ACS Applied Electronic Materials;2023-11-29

4. Evaluation and Mechanism Study of a Novel Green Chemical Mechanical Polishing Slurry for Cobalt Interconnects;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08