Author:
Huang Cheng,Zhong Min,Xu Wenhu,Yi Meirong,Li Xiaobing,Chen Jianfeng
Funder
National Natural Science Foundation of China
Reference46 articles.
1. Effects of electrochemical mechanical polishing on the polishing efficiency and quality of Co with H2O2 and BTA under alkaline conditions;Xie;ECS J Solid State Sci,2021
2. The role of diethanolamine on chemical mechanical polishing in alkaline glycine-based slurries for cobalt interconnects;Zhang;ECS J Solid State Sci,2023
3. The role of dipotassium ethylenediaminetetraacetic acid and potassium oleate on chemical mechanical planarization relevant to heterogeneous materials of cobalt interconnects;Zhang;Mater Sci Semicond Proc,2023
4. Chemical processes in the chemical-mechanical polishing of copper;Steigerwald;Mater Chem Phys,1995
5. Review on copper chemical-mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI) - an electrochemical perspective;Ein-Eli;Electrochim Acta,2007