Effects of high in-situ source/drain boron doping in p-FinFETs on physical and device performance characteristics

Author:

Shintri Shashidhar,Yong Chloe,Zhu Baofu,Byrappa Shayan,Fu Bianzhu,Lo Hsien-Ching,Choi Dongil,Kolagunta Venkat

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Strain behavior and dopant activation of heavily in-situ B-doped SiGe epitaxial films treated by nanosecond laser annealing;Materials Science in Semiconductor Processing;2024-06

2. From lab to fab: in-line SIMS for process control in nanosheet gate-all-around device manufacturing;Metrology, Inspection, and Process Control XXXVIII;2024-04-10

3. Efficient and accurate atomistic modeling of dopant migration using deep neural network;Materials Science in Semiconductor Processing;2022-06

4. Architecture and Optimization of 2T (Footprint) SRAM;IEEE Transactions on Electron Devices;2021-10

5. Abnormal Silicon-Germanium (SiGe) Epitaxial Growth in FinFETs;IEEE Transactions on Semiconductor Manufacturing;2020-05

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