Crack damage control for diamond wire sawing of silicon: The selection of processing parameters
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference39 articles.
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4. Research on the machinability of A-plane sapphire under diamond wire sawing in different sawing directions;Wang;Ceram. Int.,2019
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2. UV-OZONE Treatment for Suppressing Surface Damages on Silicon Solar Cells;ACS Applied Materials & Interfaces;2024-08-29
3. Assessment of sustainable and machinable performance metrics of monocrystalline silicon carbide wafer with electrophoretic-assisted multi-diamond wire sawing;The International Journal of Advanced Manufacturing Technology;2024-05-19
4. Assessment of Sustainable and Machinable Performance Metrics of Monocrystalline Silicon Carbide Wafer with Electrophoretic Assisted Multi-Diamond Wire Sawing;2024-03-15
5. Effect of liquid bridge on the thickness deviation between wafers sawn by diamond wire;Journal of Manufacturing Processes;2023-12
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